Abhay A. Watwe, Ph.D.

Abhay has over ten years of experience in preparing and prosecuting utility and design patent applications related to a variety of technologies, including heavy machinery; engines; mechanical assemblies; electronic devices; computer-implemented systems and methods; graphical user interfaces; and telecommunications devices and systems. His practice also includes preparing and providing non-infringement and invalidity opinions on patents related to mechanical, electrical, and digital technologies. Abhay also prepares and prosecutes inter partes review (IPR) petitions in said technology areas before the U.S. Patent and Trademark Office (USPTO).

Prior to joining Finnegan, Abhay worked at Intel Corporation for ten years. He has extensive experience in the design and validation of microprocessor packages; sockets; central processing units (CPUs) and chipset cooling solutions; printed circuit boards; and design and manufacture of chip packages, substrates, and printed circuit boards. At Intel, Abhay was involved in the design and validation of the first high-volume land-grid-array microprocessor socket and package for desktop computers; design and manufacture of high-density interconnect motherboards for Ultra Mobile PC products; and design and validation of cooling solutions for Itanium(R) microprocessors. Abhay is a co-inventor on six U.S. patents related to cooling technologies for electronic packages. He has also coauthored more than twenty publications, including three handbooks.