Abhay A. Watwe Ph.D.
Abhay Watwe’s practice includes patent prosecution, litigation, and reexaminations related to mechanical and electrical technologies. He also provides patent infringement and validity opinions.
Prior to joining Finnegan, Dr. Watwe worked at Intel Corporation for 10 years. Dr. Watwe has extensive experience in the design and validation of microprocessor packages, sockets, CPU and chipset cooling solutions, and printed circuit boards. He is co-inventor on six U.S. patents related to cooling technologies for electronic packages. He has also coauthored more than 20 publications including three handbooks.
Dr. Watwe’s doctoral research focused on immersion cooling of electronic equipment. His research included a model to predict the cooling limit during pool boiling of refrigerants on a silicon chip.
- Design and validation of the first high-volume land-grid-array microprocessor socket and package for desktop computers.
- Design and manufacture of high-density interconnect motherboards for Ultra Mobile PC products.
- Design and validation of cooling solutions for Itanium(R) microprocessors.
- Articles editor for the Lewis & Clark Law Review, 2007-2008.
- Intel Achievement Award, for land-grid-array socket development, 2005.
- Regular contributor to Finnegan's Federal Circuit IP blog and AIA blog on PTAB trials and AIA provisions.
- "Ex Parte Young Remedy for State Infringement of Intellectual Property," Lewis & Clark Law Review, 2008.
- Coauthor. "Cooling Electronic Equipment," in Mechanical Engineers’ Handbook: Energy and Power, 3rd ed., John Wiley and Sons, 2006.
- Coauthor. "Spreadsheet Tool for Quick-turn 3D Numerical Modeling of Package Thermal Performance with Non-Uniform Die Heating," Proceedings of ASME International Mechanical Engineering Congress and Exposition, 2001.
- Coauthor. "Thermal Performance Challenges from Silicon to Systems," Intel Technology Journal, 2000.
- Coauthor. "Combined Pressure and Subcooling Effects on Pool Boiling from a PPGA Chip Package," Transactions of the ASME, Journal of Electronic Packaging, 1997.