Events
InterPACK ‘09
Sponsorship;
Speaking Engagement
July 19-23, 2009
San Francisco, CA
American Society of Mechanical Engineers
Finnegan partner Les Bookoff will present “Innovation and Intellectual Property” at the American Society of Mechanical Engineers conference highlighting developments in microelectronics, photonics, microwave, MEMS and NEMS- systems packaging and integration. Finnegan is a Student Travel Grant sponsor. The program will take place at the Westin St. Francis in San Francisco, California. For more information, or to register, please see ASME’s website.